Codename of the chip is NV44

110nm process (TSMC)

77 million transistors

FC packaging (flip-chip, without a metal cap)

64-bit dual-channel memory interface

Up to 64 MB DDR/GDDR-2/GDDR-3

PCI Express16x bus interface integrated into the chip

Interface conversion into APG 8x using bidirectional PCI Express<->AGP bridge HIS

Advanced features of the system memory addressed via PCI Express to store the frame buffer, textures, and other information traditionally stored in local memory.

4 pixel processors, each with a texture unit with random floating point and integer filtering (anisotropy up to 16x).

3 vertex processors, each with a texture unit, without filtering selected values (discrete sampling)

Calculation, blending, and writing of up to 2 full (color, depth, stencil buffer) pixels per clock

Calculation and writing of up to 4 values of depth and stencil buffer per clock (no operations with color)

Support for a "double-sided" stencil buffer

Support for special geometry rendering optimizations to accelerate shadow algorithms based on a stencil buffer (so called Ultra Shadow II Technology), particularly widely used in the Doom III engine.

All necessary things to support Pixel and Vertex Shaders 3.0, including dynamic branching in pixel and vertex processors, vertex texture fetch, etc.

Floating point filtering of textures

Floating point frame buffer (including blending operations)

MRT

2 RAMDAC 400 MHz

2 DVI interfaces (require interface chips)

TV-Out and TV-In (require interface chips)

Programmable streaming video processor (for encoding, decoding, and video postprocessing purposes)

2D accelerator supporting all GDI+ functions

Integrated thermal and power monitoring.